Looking for Back End Testing Sockets for testing of Integrated Circuits?
Try our Duratron® PAI T5530, which offers dimensional stability across a wide range of temperatures as well as machining characteristics that allow for complex part design.
This 30% glass fiber reinforced grade (colour: black) offers higher stiffness, strength and creep resistance than the other Duratron PAI grades. It is well suited for structural applications supporting static loads for long periods of time at high temperatures. In addition, Duratron T5530 PAI exhibits superb dimensional stability up to 260°C making it extremely popular for precision parts in e.g. the electronical and semiconductor industries. The suitability of Duratron T5530 PAI for sliding parts, however, is to be carefully examined since the glass fibers tend to abrade the mating surface.
Chip Nests and Sockets
Back End Test
By retaining dimensional stability over a broad temperature range, parts made of Duratron T5530 PAI improve reliability of test connections and extend part life.
If ESd is required see Semitron® ESd520HR